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28 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
651
In-stock
|
Leader Tech Inc. | 0.067 X 0.19 NI 18--8-19PCI-NI-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 18.000" (457.20mm) | 0.190" (4.83mm) | Nickel | Flash | Adhesive | ||||
|
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1,204
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
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2,545
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,374
In-stock
|
Laird Technologies EMI | NOSG,STR,ZNC,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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2,321
In-stock
|
Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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1,422
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,502
In-stock
|
Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
|
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1,430
In-stock
|
Leader Tech Inc. | 0.08 X 0.45 BD 16--8-45LPAH-BD-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
|
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655
In-stock
|
Leader Tech Inc. | 0.09 X 0.92 BD 16--8-92RC-BD-16- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.920" (23.37mm) | Unplated | - | Adhesive | ||||
|
1,353
In-stock
|
Laird Technologies EMI | GASKET BECU ALLOY 11.43X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
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1,964
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,078
In-stock
|
Leader Tech Inc. | 0.08 X 0.25 BD 400--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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2,619
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,503
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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851
In-stock
|
Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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715
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,090
In-stock
|
Laird Technologies EMI | NOSG COIL NIB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,688
In-stock
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Laird Technologies EMI | NOSG COIL ZNY PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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3,642
In-stock
|
Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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3,616
In-stock
|
Laird Technologies EMI | NOSG,STR,BF | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||||
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3,563
In-stock
|
Leader Tech Inc. | 0.067 X 0.19 NI 9.0--8-19PCI-NI- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 9.000" (228.60mm) | 0.190" (4.83mm) | Nickel | Flash | Adhesive | ||||
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919
In-stock
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Leader Tech Inc. | 0.08 X 0.45 BD 16--8-S-45LPAH-BD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
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2,797
In-stock
|
Leader Tech Inc. | 0.08 X 0.25 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | ||||
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3,415
In-stock
|
Leader Tech Inc. | 0.08 X 0.45 X 060 BD 16--8-45LPC | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
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2,903
In-stock
|
Leader Tech Inc. | 0.067 X 0.19 BD 9.0--8-19PCI-BD- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 9.000" (228.60mm) | 0.190" (4.83mm) | Unplated | - | Adhesive | ||||
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3,770
In-stock
|
Leader Tech Inc. | 0.067 X 0.19 BD 18--8-19PCI-BD-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 18.000" (457.20mm) | 0.190" (4.83mm) | Unplated | - | Adhesive | ||||
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|
3,581
In-stock
|
Leader Tech Inc. | 0.08 X 0.45 SN 16--8-45LPAH-SN-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | ||||
|
2,823
In-stock
|
Laird Technologies EMI | GASKET BECU ALLOY 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||||
