- Manufacture :
- Series :
- Operating Temperature :
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74 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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2,130
In-stock
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Leader Tech Inc. | .140"H X .200" W X 48"L--OVAL--C | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Oval | 0.140" (3.56mm) | 4.00 (1.22m) | 0.200" (5.08mm) | - | - | - | ||||
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889
In-stock
|
Laird Technologies EMI | S3,STR,SNB,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Rivet | ||||
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3,484
In-stock
|
Leader Tech Inc. | 0.14 X 0.38 ZINC 16--14-38AH-ZIN | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | Flash | Adhesive | ||||
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2,408
In-stock
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Laird Technologies EMI | S3,STR,ZNC,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Rivet | ||||
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1,261
In-stock
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Leader Tech Inc. | 0.14 X 0.38 SN 16--14-38AH-SN-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | Flash | Adhesive | ||||
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1,155
In-stock
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Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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3,003
In-stock
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Leader Tech Inc. | .140"H X 250"W 48"L--RECTANGULAR | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.140" (3.56mm) | 4.00 (1.22m) | 0.250" (6.35mm) | - | - | - | ||||
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1,820
In-stock
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Leader Tech Inc. | .140"H X .250"W X 48"L--D SHAPED | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | D-Shape | 0.140" (3.56mm) | 4.00 (1.22m) | 0.250" (6.35mm) | - | - | - | ||||
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2,060
In-stock
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Laird Technologies EMI | S3,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
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2,928
In-stock
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Laird Technologies EMI | S3,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
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1,836
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 10.67X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.420" (10.67mm) | - | - | Clip | ||||
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1,119
In-stock
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Laird Technologies EMI | AP COIL NIB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,038
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 10.67X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.420" (10.67mm) | - | - | Clip | ||||
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896
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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956
In-stock
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Laird Technologies EMI | S3,STR,NIB,USFT,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,969
In-stock
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Laird Technologies EMI | S3,STR,SNB,USFT,RIVIT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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673
In-stock
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Laird Technologies EMI | S3,STR,NIE,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Rivet | ||||
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3,167
In-stock
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Laird Technologies EMI | S3,STR,NIB,RIVIT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Rivet | ||||
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2,552
In-stock
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Leader Tech Inc. | 0.14 X 0.51 SN 16.0--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | Flash | Adhesive | ||||
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3,398
In-stock
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Leader Tech Inc. | 0.14 X 0.510 NI 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | Flash | Adhesive | ||||
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1,341
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 11.43X381MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Rivet | ||||
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1,331
In-stock
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Leader Tech Inc. | 0.14 X 0.36 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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2,077
In-stock
|
Laird Technologies EMI | S3,STR,NIB,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Rivet | ||||
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3,205
In-stock
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Laird Technologies EMI | GASKET BECU 8.26X406.4MM | Dual Slot | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.325" (8.26mm) | - | - | Slot | ||||
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3,741
In-stock
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Laird Technologies EMI | .140X.370 GASKET FABRIC O/ FOAM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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1,238
In-stock
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Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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762
In-stock
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Leader Tech Inc. | 0.14 X 0.36 BD SN 16--FOLDED SER | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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979
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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1,890
In-stock
|
Laird Technologies EMI | AP,STR,NIB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,162
In-stock
|
Laird Technologies EMI | AP,STR,SNB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
