Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
2,545
In-stock
Laird Technologies EMI NOSG,STR,SNB,USFT,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,542
In-stock
Laird Technologies EMI CLO,STRSNB,USFT Clip-On Active Beryllium Copper 121°C Fingerstock 0.080" (2.03mm) 16.000" (406.40mm) 0.440" (11.18mm) Tin 299.21µin (7.60µm) Clip
Default Photo
RFQ
1,422
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock 0.080" (2.03mm) 0.262" (6.67mm) 0.450" (11.43mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,964
In-stock
Laird Technologies EMI NOSG,STR,SNB,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,503
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA Foldover Active Beryllium Copper 121°C Fingerstock 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
715
In-stock
Laird Technologies EMI NOSG COIL SNB PSA Foldover Active Beryllium Copper 121°C Fingerstock 0.080" (2.03mm) 25.000 (7.62m) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,797
In-stock
Leader Tech Inc. 0.08 X 0.25 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin Flash Adhesive
Default Photo
RFQ
3,581
In-stock
Leader Tech Inc. 0.08 X 0.45 SN 16--8-45LPAH-SN-1 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.080" (2.03mm) 16.000" (406.40mm) 0.450" (11.43mm) Tin Flash Adhesive