- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
- Applied Filters :
23 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
3,021
In-stock
|
Leader Tech Inc. | 0.03 X 0.15 X 070 SN 16--TWIST C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | ||||
|
2,367
In-stock
|
Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | - | Adhesive | ||||
|
3,320
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 4X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,101
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 3.81X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.150" (3.81mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
|
|
1,637
In-stock
|
Leader Tech Inc. | 0.03 X 0.23 SN 24 NTP--3-S-23T-S | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | ||||
|
|
3,578
In-stock
|
Leader Tech Inc. | 0.03 X 0.23 SN 24--3-S-23T-SN-24 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | ||||
|
|
973
In-stock
|
Leader Tech Inc. | 0.03 X 0.15 X 070 SN 16--TWIST C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | ||||
|
|
3,276
In-stock
|
Leader Tech Inc. | 0.03 X 0.08 SN 24--TWIST RIGHT A | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.080" (2.03mm) | Tin | Flash | Adhesive | ||||
|
|
3,187
In-stock
|
Leader Tech Inc. | 0.03 X 0.20 SN 24--3-20T-SN-24-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | Tin | Flash | Adhesive | ||||
|
|
2,002
In-stock
|
Leader Tech Inc. | 0.03 X 0.08 SN 300--TWIST RIGHT | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 25.00 (7.62m) | 0.080" (2.03mm) | Tin | Flash | Adhesive | ||||
|
|
3,217
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,223
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,CLO | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.150" (3.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,672
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,USF,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,307
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,USF,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,168
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,RA,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
698
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,798
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
782
In-stock
|
Leader Tech Inc. | 0.03 X 0.08 ST 24 NTP--TWIST RIG | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.080" (2.03mm) | Tin | Flash | Adhesive | ||||
|
|
2,980
In-stock
|
Laird Technologies EMI | TWT COIL SNB USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,784
In-stock
|
Laird Technologies EMI | TWT COIL NIB USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
864
In-stock
|
Laird Technologies EMI | TWT COIL SNB PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,021
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,620
In-stock
|
Leader Tech Inc. | 0.03 X 0.23 SN 16--3-23T-SN-16-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | ||||
