Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
1,411
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA No Snag Active Beryllium Copper 121°C Fingerstock 0.090" (2.29mm) 16.000" (406.40mm) 0.320" (8.13mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,733
In-stock
Leader Tech Inc. 0.09 X 0.78 SN 16--9-78D-SN-16-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.090" (2.29mm) 16.000" (406.40mm) 0.780" (19.81mm) Tin Flash Adhesive