Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
1,814
In-stock
Laird Technologies EMI AP,STR,SNPB,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Lead, Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,952
In-stock
Leader Tech Inc. 0.25 X 1.09 X 130 SN 16--25-109C - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 16.000" (406.40mm) 1.090" (27.69mm) Tin Flash Adhesive
Default Photo
RFQ
1,740
In-stock
Laird Technologies EMI CSTR COIL ZNY Large Enclosure Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 25.000 (7.62m) 1.090" (27.69mm) Zinc + Yellow Chromate 299.21µin (7.60µm) Hardware, Rivet, Solder
Default Photo
RFQ
2,798
In-stock
Leader Tech Inc. 0.25 X 1.09 X 120 NI 16--25-109C - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 16.000" (406.40mm) 1.090" (27.69mm) Nickel Flash Adhesive
Default Photo
RFQ
1,583
In-stock
Laird Technologies EMI AP,STR,CDY,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Zinc + Yellow Chromate 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
604
In-stock
Leader Tech Inc. 0.25 X 0.78 X 0.50 SU 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated - Adhesive
Default Photo
RFQ
926
In-stock
Leader Tech Inc. 0.25 X 0.78 SU 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated - Adhesive
Default Photo
RFQ
2,885
In-stock
Laird Technologies EMI CSTR COIL BF USF Large Enclosure Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 25.000 (7.60m) 1.090" (27.69mm) Unplated - Adhesive
Default Photo
RFQ
1,576
In-stock
Laird Technologies EMI CSTR COIL NIB Large Enclosure Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 25.000 (7.60m) 1.090" (27.69mm) Nickel 299.21µin (7.60µm) Hardware, Rivet, Solder
Default Photo
RFQ
3,976
In-stock
Laird Technologies EMI CSTR COIL NIE Large Enclosure Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 25.000 (7.60m) 1.090" (27.69mm) Nickel 299.21µin (7.60µm) Hardware, Rivet, Solder
Default Photo
RFQ
1,369
In-stock
Laird Technologies EMI CSTR COIL SNB Large Enclosure Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 25.000 (7.60m) 1.090" (27.69mm) Tin 299.21µin (7.60µm) Hardware, Rivet, Solder
Default Photo
RFQ
2,697
In-stock
Laird Technologies EMI AP,STR,BF - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) - - Adhesive
Default Photo
RFQ
1,429
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 85.875 NTP--FOLDE - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 7.16 (2.18m) 0.780" (19.81mm) Unplated - Adhesive
0097043602
RFQ
2,973
In-stock
Laird Technologies EMI FINGERSTOCK BECU 24MMX406.4MM - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 0.375" (9.53mm) 0.940" (23.88mm) - - Hardware, Rivet, Solder
25-55CPS-SN-16
RFQ
713
In-stock
Leader Tech Inc. COPPER BERYLLIUM FINGERSTOCK EMI - Active Beryllium Copper - Fingerstock 0.250" (6.35mm) 16.000" (406.40mm) 0.550" (13.97mm) Tin - Adhesive
Default Photo
RFQ
1,881
In-stock
Leader Tech Inc. 0.25 X 1.09 NI 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 1.090" (27.69mm) Nickel Flash Adhesive
0C97043802
RFQ
2,088
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Large Enclosure Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 25.000 (7.62m) 1.090" (27.69mm) - - Hardware, Rivet, Solder
Default Photo
RFQ
3,026
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 300"--FOLDED SERI - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 25.00 (7.62m) 0.780" (19.81mm) Unplated - Adhesive
Default Photo
RFQ
2,986
In-stock
Leader Tech Inc. 0.25 X 1.09 BD 300"--FOLDED SERI - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Unplated - Adhesive
Default Photo
RFQ
1,074
In-stock
Leader Tech Inc. 0.25 X 1.09 SN 300"--FOLDED SERI - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Tin Flash Adhesive
Default Photo
RFQ
2,255
In-stock
Leader Tech Inc. 0.25 X 1.09 SU 300"--FOLDED SERI - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Unplated - Adhesive
Default Photo
RFQ
1,871
In-stock
Laird Technologies EMI AP,STR,NIE,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,982
In-stock
Laird Technologies EMI AP,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,761
In-stock
Laird Technologies EMI AP,STR,SNSAT,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,504
In-stock
Leader Tech Inc. 0.25 X 1.09 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 1.090" (27.69mm) Unplated - Adhesive
Default Photo
RFQ
2,191
In-stock
Laird Technologies EMI AP,STR,BF,USF,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) - - Adhesive
25-55CPS-BD-16
RFQ
1,125
In-stock
Leader Tech Inc. COPPER BERYLLIUM FINGERSTOCK EMI - Active Beryllium Copper - Fingerstock 0.250" (6.35mm) 16.000" (406.40mm) 0.550" (13.97mm) - - Adhesive
Default Photo
RFQ
3,336
In-stock
Leader Tech Inc. 0.25 X 0.78 SN 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
2,183
In-stock
Leader Tech Inc. 0.25 X 0.78 X 0.50 SN 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
3,428
In-stock
Leader Tech Inc. 0.25 X 1.09 SN 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 1.090" (27.69mm) Tin Flash Adhesive