Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
3,559
In-stock
Laird Technologies EMI AP,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock 0.310" (7.87mm) 24.000" (609.60mm) 0.670" (17.02mm) Tin 299.21µin (7.60µm) Adhesive
0097053602
RFQ
1,321
In-stock
Laird Technologies EMI GASKET BECU 17X609.6MM - Active Beryllium Copper 121°C Fingerstock 0.310" (7.87mm) 24.000" (609.60mm) 0.670" (17.02mm) - - Adhesive
Default Photo
RFQ
2,231
In-stock
Laird Technologies EMI AP,STR,BF,USF,PSA - Active Beryllium Copper 121°C Fingerstock 0.310" (7.87mm) 24.000" (609.60mm) 0.670" (17.02mm) - - Adhesive