Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Attachment Method
GLOBAL STOCKS
0C98055902
RFQ
3,260
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
0C97055502
RFQ
3,286
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
0C97055902
RFQ
3,592
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
0C97055002
RFQ
3,781
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
RFQ
3,622
In-stock
Laird Technologies EMI TWT COIL BF USF PSA Twist Active Beryllium Copper 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive