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4 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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952
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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618
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,292
In-stock
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Laird Technologies EMI | NOSG,STR,SNSAT,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,411
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
