RFI and EMI - Contacts, Fingerstock and Gaskets Products For Sale - PDF - RF/IF and RFID - Risen Electronics

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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Material	Operating Temperature	Type	Height	Length	Width	Plating	Attachment Method
GLOBAL STOCKS
	10-30C-070-DL-BD-16		PDF RFQ	1,882 In-stock	Leader Tech Inc.	0.10 X 0.30 X 070 BD 16--10-30C-		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-065-DL-BD-16		PDF RFQ	3,303 In-stock	Leader Tech Inc.	0.10 X 0.30 X 065 BD 16--10-30C-		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-050-DL-BD-16		PDF RFQ	3,143 In-stock	Leader Tech Inc.	0.10 X 0.30 X 050 DL BD 16--10-3		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-045-DL-BD-16		PDF RFQ	758 In-stock	Leader Tech Inc.	0.10 X 0.30 X 045 DL BD 16--10-3		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-070-BD-16		PDF RFQ	3,004 In-stock	Leader Tech Inc.	0.10 X 0.30 X 070 BD 16--10-30C-		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-065-BD-16		PDF RFQ	1,951 In-stock	Leader Tech Inc.	0.10 X 0.30 X 065 BD 16--10-30C-		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-050-BD-16		PDF RFQ	3,563 In-stock	Leader Tech Inc.	0.10 X 0.30 X 050 BD 16--10-30C-		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	10-30C-045-BD-16		PDF RFQ	661 In-stock	Leader Tech Inc.	0.10 X 0.30 X 0.045 BD 16--10-30		TechMESH	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.100" (2.54mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive
	0C98055902		PDF RFQ	3,260 In-stock	Laird Technologies EMI	RFI EMI GROUNDING MATERIAL 25FT		Twist	Active	Beryllium Copper	121°C	Fingerstock	0.070" (1.78mm)	24.000" (609.60mm)	0.300" (7.62mm)	Unplated	Adhesive
	0C97055902		PDF RFQ	3,592 In-stock	Laird Technologies EMI	RFI EMI GROUNDING MATERIAL 25FT		Twist	Active	Beryllium Copper	121°C	Fingerstock	0.070" (1.78mm)	24.000" (609.60mm)	0.300" (7.62mm)	Unplated	Adhesive
	4-34D-BD-16		PDF RFQ	2,509 In-stock	Leader Tech Inc.	0.04 X 0.34 BD 16--4-34D-BD-16--		-	Active	Beryllium Copper	-55°C ~ 121°C	Fingerstock	0.040" (1.02mm)	16.000" (406.40mm)	0.300" (7.62mm)	Unplated	Adhesive

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