Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
3,184
In-stock
Leader Tech Inc. 0.07 X .25 X 045 SNPB 24--7-21C- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.250" (6.35mm) Lead, Tin Flash Adhesive
Default Photo
RFQ
2,321
In-stock
Laird Technologies EMI NOSG COIL BF PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated - Adhesive
Default Photo
RFQ
716
In-stock
Laird Technologies EMI NOSG,STR,BF,USFT Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - -
Default Photo
RFQ
1,811
In-stock
Leader Tech Inc. 0.07 X .25 X 045 CDC 16--7-21C-0 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 16.000" (406.40mm) 0.250" (6.35mm) Cadmium + Clear Chromate Flash Adhesive
0098054202
RFQ
2,883
In-stock
Laird Technologies EMI FINGERSTCK ULTRASFT 6.35X406.4MM Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - -
Default Photo
RFQ
1,964
In-stock
Laird Technologies EMI NOSG,STR,SNB,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,078
In-stock
Leader Tech Inc. 0.08 X 0.25 BD 400--FOLDED SERIE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.080" (2.03mm) 33.33 (10.16m) 0.250" (6.35mm) Unplated - Adhesive
Default Photo
RFQ
2,619
In-stock
Laird Technologies EMI NOSG,STR,NIB,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,503
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
851
In-stock
Laird Technologies EMI NOSG,STR,ZNC,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
715
In-stock
Laird Technologies EMI NOSG COIL SNB PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 25.000 (7.62m) 0.250" (6.35mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,090
In-stock
Laird Technologies EMI NOSG COIL NIB PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,688
In-stock
Laird Technologies EMI NOSG COIL ZNY PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Zinc + Yellow Chromate 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,642
In-stock
Laird Technologies EMI NOSG COIL BF USF PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated - Adhesive
Default Photo
RFQ
3,616
In-stock
Laird Technologies EMI NOSG,STR,BF Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - Adhesive
8-25FSC-BD-16
RFQ
3,976
In-stock
Leader Tech Inc. COPPER BERYLLIUM FINGERSTOCK EMI - Active Beryllium Copper - Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - -
Default Photo
RFQ
2,495
In-stock
Leader Tech Inc. 0.07 X .25 X 045 NI 16--7-21C-04 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 16.000" (406.40mm) 0.250" (6.35mm) Nickel Flash Adhesive
Default Photo
RFQ
2,894
In-stock
Leader Tech Inc. 0.07 X .25 X 045 SN 16--7-21C-04 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin Flash Adhesive
Default Photo
RFQ
2,797
In-stock
Leader Tech Inc. 0.08 X 0.25 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) Tin Flash Adhesive
Default Photo
RFQ
2,019
In-stock
Leader Tech Inc. 0.07 X .25 X 045 BD 16--7-21C-04 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated - Adhesive
0097054202
RFQ
2,823
In-stock
Laird Technologies EMI GASKET BECU ALLOY 6.35X406.4MM Foldover Active Beryllium Copper 121°C Fingerstock - 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - Adhesive