Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
1,848
In-stock
Laird Technologies EMI NOSG COIL BF PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Unplated - Adhesive
Default Photo
RFQ
3,125
In-stock
Laird Technologies EMI CLO,STR,TLN,SNB,USFT Clip-On Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.440" (11.18mm) Tin 299.21µin (7.60µm) Clip
0097062202
RFQ
733
In-stock
Laird Technologies EMI FINGRSTK BECU ALY 11.176X406.4MM - Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.440" (11.78mm) - - Clip
Default Photo
RFQ
2,296
In-stock
Leader Tech Inc. 0.12 X 0.75 BD 16--12-75RS-BD-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.750" (19.05mm) Unplated - Adhesive
Default Photo
RFQ
1,024
In-stock
Leader Tech Inc. 0.12 X 0.60 BD 16--12-60LPAH-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.600" (15.24mm) Unplated - Adhesive
0097054102
RFQ
3,014
In-stock
Laird Technologies EMI GASKET BECU 9.65X406.4MM Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) - - Adhesive
Default Photo
RFQ
1,531
In-stock
Laird Technologies EMI NOSG,STR,NIB,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,036
In-stock
Laird Technologies EMI NOSG,STR,SNB,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
698
In-stock
Laird Technologies EMI NOSG,STR,SNB,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,905
In-stock
Laird Technologies EMI NOSG,STR,ZNC,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,423
In-stock
Leader Tech Inc. .120"H X .155"W X 16.00"L--RECTA - Active Polyurethane Foam, Nickel-Copper Polyester (NI/CU) -40°C ~ 70°C Fabric Over Foam Rectangular 0.120" (3.05mm) 16.000" (406.40mm) 0.155" (3.94mm) - - -
Default Photo
RFQ
1,746
In-stock
Laird Technologies EMI NOSG,STR,BF,USF,PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) - - Adhesive
Default Photo
RFQ
3,213
In-stock
Laird Technologies EMI NOSG COIL SNB PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,613
In-stock
Leader Tech Inc. 0.12 X 0.75 SN 16--12-75RS-SN-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.750" (19.05mm) Tin Flash Adhesive
Default Photo
RFQ
1,167
In-stock
Leader Tech Inc. 0.12 X 0.60 SN 16--12-60LPAH-SN- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.600" (15.24mm) Tin Flash Adhesive
0097054118
RFQ
1,853
In-stock
Laird Technologies EMI GASKET BECU 9.65X406.4MM Foldover Active Beryllium Copper 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.380" (9.65mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,340
In-stock
Leader Tech Inc. 0.12 X 0.75 SN 16 NTP--12-75RS-S - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.120" (3.05mm) 16.000" (406.40mm) 0.750" (19.05mm) Tin Flash Adhesive