Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Frequency Current - Supply Package / Case Supplier Device Package Voltage - Supply Gain Noise Figure P1dB RF Type Test Frequency
GLOBAL STOCKS
BGA777N7E6327XTSA1 RFQ
RFQ
2,263
In-stock
Infineon Technologies IC AMP SI-MMIC - Active Digi-Reel® 2.3GHz ~ 2.7GHz 4.2mA 6-XFDFN Exposed Pad TSNP-7-1 2.6 V ~ 3 V 16dB 1.2dB - UMTS 2.3GHz ~ 2.7MHz
BGA777N7E6327XTSA1
RFQ
3,469
In-stock
Infineon Technologies IC AMP SI-MMIC - Active Cut Tape (CT) 2.3GHz ~ 2.7GHz 4.2mA 6-XFDFN Exposed Pad TSNP-7-1 2.6 V ~ 3 V 16dB 1.2dB - UMTS 2.3GHz ~ 2.7MHz
BGA777N7E6327XTSA1
RFQ
807
In-stock
Infineon Technologies IC AMP SI-MMIC - Active Tape & Reel (TR) 2.3GHz ~ 2.7GHz 4.2mA 6-XFDFN Exposed Pad TSNP-7-1 2.6 V ~ 3 V 16dB 1.2dB - UMTS 2.3GHz ~ 2.7MHz
BGM15HA12E6327XTSA1 RFQ
RFQ
2,551
In-stock
Infineon Technologies IC AMP MMIC 12ATSLP - Active Digi-Reel® 2.3GHz ~ 2.7GHz 5.9mA 12-UFQFN Exposed Pad ATSLP-12-3 2.2 V ~ 3.3 V 16.3dB 1.2dB - W-CDMA 2.3GHz ~ 2.7GHz
BGM15HA12E6327XTSA1
RFQ
1,682
In-stock
Infineon Technologies IC AMP MMIC 12ATSLP - Active Cut Tape (CT) 2.3GHz ~ 2.7GHz 5.9mA 12-UFQFN Exposed Pad ATSLP-12-3 2.2 V ~ 3.3 V 16.3dB 1.2dB - W-CDMA 2.3GHz ~ 2.7GHz
BGM15HA12E6327XTSA1
RFQ
3,424
In-stock
Infineon Technologies IC AMP MMIC 12ATSLP - Active Tape & Reel (TR) 2.3GHz ~ 2.7GHz 4.9mA 12-UFQFN Exposed Pad ATSLP-12-3 2.2 V ~ 3.3 V 16.3dB 1.2dB -8dBm LTE, W-CDMA -