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11 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Interface | Supplier Device Package | Number of Circuits | Voltage - Supply | Function | Power (Watts) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
|
RFQ |
1,821
In-stock
|
IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 16+1CH 416BGA | - | Obsolete | Tray | - | -40°C ~ 85°C | Surface Mount | 416-BGA | E1, J1, T1 | 416-PBGA (27x27) | 1 | 1.8V, 3.3V | Line Interface Unit (LIU) | - | |||
|
RFQ |
3,522
In-stock
|
IDT, Integrated Device Technology Inc | IC LINE INTERFACE UNIT 416BGA | - | Obsolete | Tray | - | -40°C ~ 85°C | Surface Mount | 416-BGA | E1, J1, T1 | 416-PBGA (27x27) | 1 | 1.8V, 3.3V | Line Interface Unit (LIU) | - | |||
|
RFQ |
825
In-stock
|
Infineon Technologies | IC LIU E1/T1/J1 80MQFP | FALC™ | Obsolete | Tray | 80mA | -40°C ~ 85°C | Surface Mount | 80-QFP | E1, HDLC, J1, T1 | P-MQFP-80-1 | 1 | 1.8V, 3.3V | Framer, Line Interface Unit (LIU) | 250mW | |||
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|
RFQ |
1,690
In-stock
|
Infineon Technologies | IC LIU E1/T1/J1 81LBGA | FALC™ | Obsolete | Tray | 80mA | -40°C ~ 85°C | Surface Mount | 81-LBGA | E1, HDLC, J1, T1 | P-LBGA-81 | 1 | 1.8V, 3.3V | Framer, Line Interface Unit (LIU) | 250mW | |||
|
RFQ |
819
In-stock
|
Maxim Integrated | IC TDM/PACKET TRANSPORT 676BGA | - | Discontinued at Digi-Key | Tray | - | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | - | |||
|
|
3,857
In-stock
|
Exar Corporation | 8 CH LH/SH T1/E1 LIU + FRAMER (8 | - | Active | - | - | -40°C ~ 85°C | - | - | E1, J1, T1 | - | 1 | 1.8V, 3.3V | Framer, Line Interface Unit (LIU) | - | ||||
|
|
3,407
In-stock
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Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | - | Not For New Designs | Tray | - | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | - | ||||
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|
2,549
In-stock
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IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 21+1CH 640BGA | - | Active | Tray | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | E1, J1, T1 | 640-TEPBGA (31x31) | 1 | 1.8V, 3.3V | Line Interface Unit (LIU) | - | ||||
|
2,333
In-stock
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IDT, Integrated Device Technology Inc | IC LINE INTERFACE UNIT 640BGA | - | Active | Tray | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | E1, J1, T1 | 640-TEPBGA (31x31) | 1 | 1.8V, 3.3V | Line Interface Unit (LIU) | - | ||||
|
|
1,401
In-stock
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Exar Corporation | IC LIU/FRAMER 256PBGA | - | Active | Bulk | - | -40°C ~ 85°C | Surface Mount | 256-FBGA | E1, J1, T1 | 256-FPBGA (17x17) | 1 | 1.8V, 3.3V | Framer, Line Interface Unit (LIU) | - | ||||
|
|
1,334
In-stock
|
Maxim Integrated | IC TDM OVER PACKET 676-BGA | - | Active | Tray | - | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | - | ||||
