- Manufacture :
- Packaging :
- Operating Temperature :
- Supplier Device Package :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Connectivity :
-
- CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI (4)
- CAN, EBI/EMI, I²C, LIN, SPI, UART/USART (2)
- CAN, Ethernet, I²C, LIN, SPI, UART, USB (1)
- CAN, I²C, LIN, SPI, SSC, UART/USART, USI (2)
- CAN, I²C, LIN, SPI, UART/USART (3)
- CAN, I²C, LIN, SPI, UART/USART, USB (7)
- CAN, I²C, SCI, SPI (15)
- CAN, LIN, SCI, SPI (11)
- CAN, SCI, SPI (8)
- Configurable (10)
- I²C, LIN, SPI, UART/USART (4)
- LIN, SCI, SPI (9)
- SCI, SPI (2)
- Program Memory Type :
- EEPROM Size :
- Oscillator Type :
- Applied Filters :
78 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
2,074
In-stock
|
Infineon Technologies | IC MCU 16BIT 160KB FLASH 64LQFP | XE162xL | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-22 | DMA, I²S, POR, PWM, WDT | C166SV2 | 80MHz | 3 V ~ 5.5 V | 48 | 12K x 8 | 16-Bit | CAN, I²C, LIN, SPI, SSC, UART/USART, USI | 160KB (160K x 8) | Flash | - | A/D 19x12b | Internal | ||||
|
3,797
In-stock
|
Infineon Technologies | IC MCU 32BIT 64KB FLASH 64LQFP | XMC4000 | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-19 | DMA, I²S, LED, POR, PWM, WDT | ARM® Cortex®-M4 | 80MHz | 3.13 V ~ 3.63 V | 35 | 20K x 8 | 32-Bit | CAN, I²C, LIN, SPI, UART/USART, USB | 64KB (64K x 8) | Flash | - | A/D 10x12b; D/A 2x12b | Internal | ||||
|
|
1,355
In-stock
|
XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 6-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
|
2,475
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 8K x 8 | 16-Bit | LIN, SCI, SPI | 128KB (128K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
3,564
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 8K x 8 | 16-Bit | CAN, SCI, SPI | 128KB (128K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
3,702
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 64 | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 4K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 64KB (64K x 8) | Flash | 1K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
|
|
2,661
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
|
|
3,599
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 128KB (128K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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|
3,083
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 128KB (128K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
|
|
3,177
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 96 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 96KB (96K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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|
857
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 16 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 2K x 8 | 16-Bit | SCI, SPI | 16KB (16K x 8) | Flash | 128 x 8 | A/D 9x12b | Internal | ||||
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1,445
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 64 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 4K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 64KB (64K x 8) | Flash | 1K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
|
|
3,339
In-stock
|
XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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|
3,185
In-stock
|
XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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|
3,787
In-stock
|
XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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|
858
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | Automotive, AEC-Q100, S12 MagniV | Active | Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x12b, D/A 1x8b | Internal | ||||
|
|
1,716
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 32 | S12 MagniV | Active | Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 4K x 8 | 16-Bit | CAN, LIN, SCI, SPI | 32KB (32K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
3,645
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 8K x 8 | 16-Bit | LIN, SCI, SPI | 128KB (128K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
1,511
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 8K x 8 | 16-Bit | CAN, SCI, SPI | 128KB (128K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
3,700
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 64 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 4K x 8 | 16-Bit | CAN, LIN, SCI, SPI | 64KB (64K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
2,344
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 8K x 8 | 16-Bit | LIN, SCI, SPI | 128KB (128K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
983
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
|
|
1,873
In-stock
|
Infineon Technologies | IC MCU 32BIT 256KB FLASH 64LQFP | XMC4000 | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-19 | DMA, I²S, LED, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 3.13 V ~ 3.63 V | 31 | 80K x 8 | 32-Bit | CAN, I²C, LIN, SPI, UART/USART, USB | 256KB (256K x 8) | Flash | - | A/D 14x12b; D/A 2x12b | Internal | ||||
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2,191
In-stock
|
Infineon Technologies | IC MCU 16BIT 320KB FLASH 64LQFP | XC27x4X | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-6 | I²S, POR, PWM, WDT | C166SV2 | 80MHz | 3 V ~ 5.5 V | 38 | 34K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 320KB (320K x 8) | Flash | - | A/D 9x10b | Internal | ||||
|
|
2,496
In-stock
|
Infineon Technologies | IC MCU 16BIT 320KB FLASH 64LQFP | XC23xxB | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-6 | I²S, POR, PWM, WDT | C166SV2 | 80MHz | 3 V ~ 5.5 V | 38 | 34K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 320KB (320K x 8) | Flash | - | A/D 9x10b | Internal | ||||
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|
855
In-stock
|
Infineon Technologies | IC MCU 16BIT 320KB FLASH 64LQFP | XE16x | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-6 | I²S, POR, PWM, WDT | C166SV2 | 80MHz | 3 V ~ 5.5 V | 40 | 34K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 320KB (320K x 8) | Flash | - | A/D 9x10b | Internal | ||||
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|
3,934
In-stock
|
Infineon Technologies | IC MCU 16BIT 160KB FLASH 64LQFP | XC22xxL | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | PG-LQFP-64-22 | I²S, POR, PWM, WDT | C166SV2 | 66MHz | 3 V ~ 5.5 V | 48 | 10K x 8 | 16/32-Bit | CAN, I²C, LIN, SPI, SSC, UART/USART, USI | 160KB (160K x 8) | Flash | - | A/D 19x12b | Internal | ||||
|
|
3,917
In-stock
|
XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 6-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
|
|
2,667
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 32 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 4K x 8 | 16-Bit | CAN, LIN, SCI, SPI | 32KB (32K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
|
|
1,184
In-stock
|
NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 64 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) | DMA, POR, PWM, WDT | S12Z | 50MHz | 3.5 V ~ 40 V | 31 | 4K x 8 | 16-Bit | CAN, LIN, SCI, SPI | 64KB (64K x 8) | Flash | 512 x 8 | A/D 9x12b | Internal | ||||
