Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Type Oscillator Type
GLOBAL STOCKS
XE216-512-FB236-I20
RFQ
3,332
In-stock
XMOS IC MCU 32BIT ROMLESS 236FBGA XE Active Tray -40°C ~ 85°C (TA) 236-LFBGA 236-FBGA (10x10) - XCore 2000MIPS 0.95 V ~ 3.6 V 73 512K x 8 32-Bit 16-Core RGMII, USB ROMless External
XE216-512-TQ128-I20
RFQ
2,476
In-stock
XMOS IC MCU 32BIT ROMLESS 128TQFP XE Active Tray -40°C ~ 85°C (TA) 128-TQFP Exposed Pad 128-TQFP (14x14) - XCore 2000MIPS 0.95 V ~ 3.6 V 67 512K x 8 32-Bit 16-Core RGMII, USB ROMless External
XE232-1024-FB374-I40
RFQ
860
In-stock
XMOS IC MCU 32BIT ROMLESS 374FBGA XE Active Tray -40°C ~ 85°C (TA) 374-LFBGA 374-FBGA (18x18) - XCore 4000MIPS 0.95 V ~ 3.6 V 176 1M x 8 32-Bit 32-Core RGMII, USB ROMless External
XE232-1024-FB374-C40
RFQ
886
In-stock
XMOS IC MCU 32BIT ROMLESS 374FBGA XE Active Tray 0°C ~ 70°C (TA) 374-LFBGA 374-FBGA (18x18) - XCore 4000MIPS 0.95 V ~ 3.6 V 176 1M x 8 32-Bit 32-Core RGMII, USB ROMless External
XE216-512-FB236-C20
RFQ
2,740
In-stock
XMOS IC MCU 32BIT ROMLESS 236FBGA XE Active Tray 0°C ~ 70°C (TA) 236-LFBGA 236-FBGA (10x10) - XCore 2000MIPS 0.95 V ~ 3.6 V 73 512K x 8 32-Bit 16-Core RGMII, USB ROMless External
XE216-512-TQ128-C20
RFQ
2,855
In-stock
XMOS IC MCU 32BIT ROMLESS 128TQFP XE Active Tray 0°C ~ 70°C (TA) 128-TQFP Exposed Pad 128-TQFP (14x14) - XCore 2000MIPS 0.95 V ~ 3.6 V 67 512K x 8 32-Bit 16-Core RGMII, USB ROMless External