Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
MC68L711E9FNE2 RFQ
RFQ
3,027
In-stock
NXP USA Inc. IC MCU 8BIT 12KB OTP 52PLCC HC11 Obsolete Tube 0°C ~ 70°C (TA) 52-LCC (J-Lead) 52-PLCC (19.1x19.1) POR, WDT HC11 2MHz 3 V ~ 5.5 V 38 512 x 8 8-Bit SCI, SPI 12KB (12K x 8) OTP A/D 8x8b Internal
MC68HCP11E0FNE RFQ
RFQ
3,573
In-stock
NXP USA Inc. IC MCU 8BIT ROMLESS 52PLCC HC11 Obsolete Tube 0°C ~ 70°C (TA) 52-LCC (J-Lead) 52-PLCC (19.1x19.1) POR, WDT HC11 3MHz 4.5 V ~ 5.5 V 38 512 x 8 8-Bit SCI, SPI - ROMless A/D 8x8b Internal
MC68HCP11E0FN RFQ
RFQ
2,471
In-stock
NXP USA Inc. IC MCU 8BIT ROMLESS 52PLCC HC11 Obsolete Tube 0°C ~ 70°C (TA) 52-LCC (J-Lead) 52-PLCC (19.1x19.1) POR, WDT HC11 3MHz 4.5 V ~ 5.5 V 38 512 x 8 8-Bit SCI, SPI - ROMless A/D 8x8b Internal
MC68L11E1FNE2 RFQ
RFQ
3,019
In-stock
NXP USA Inc. IC MCU 8BIT ROMLESS 52PLCC HC11 Obsolete Tube 0°C ~ 70°C (TA) 52-LCC (J-Lead) 52-PLCC (19.1x19.1) POR, WDT HC11 2MHz 3 V ~ 5.5 V 38 512 x 8 8-Bit SCI, SPI - ROMless A/D 8x8b Internal
MC68L11E0FNE2 RFQ
RFQ
928
In-stock
NXP USA Inc. IC MCU 8BIT ROMLESS 52PLCC HC11 Obsolete Tube 0°C ~ 70°C (TA) 52-LCC (J-Lead) 52-PLCC (19.1x19.1) POR, WDT HC11 2MHz 3 V ~ 5.5 V 38 512 x 8 8-Bit SCI, SPI - ROMless A/D 8x8b Internal
XS1-U6A-64-FB96-C5
RFQ
3,365
In-stock
XMOS IC MCU 32BIT 64KB SRAM 96FBGA XS1 Active Tray 0°C ~ 70°C (TA) 96-LFBGA 96-FBGA (10x10) - XCore 500MIPS 3 V ~ 3.6 V 38 - 32-Bit 6-Core Configurable 64KB (16K x 32) SRAM A/D 4x12b Internal
XS1-U8A-64-FB96-C5
RFQ
2,891
In-stock
XMOS IC MCU 32BIT 64KB SRAM 96FBGA XS1 Active Tray 0°C ~ 70°C (TA) 96-LFBGA 96-FBGA (10x10) - XCore 500MIPS 3 V ~ 3.6 V 38 - 32-Bit 8-Core Configurable 64KB (16K x 32) SRAM A/D 4x12b Internal