- Manufacture :
- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Program Memory Size :
- Oscillator Type :
- Applied Filters :
43 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
616
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,135
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,809
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,490
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,140
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,625
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,856
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,448
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,117
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,635
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 112MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,907
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,117
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,427
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
3,464
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
3,761
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
1,749
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
3,133
In-stock
|
STMicroelectronics | IC MCU 32BIT 2MB FLASH 324BGA | SPC56 | Active | Tray | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 1.32 V | 190 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
2,683
In-stock
|
STMicroelectronics | IC MCU 32BIT 2MB FLASH 324BGA | SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 1.32 V | 190 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
1,291
In-stock
|
Microchip Technology | IC MCU 32BIT 512KB FLASH 100TQFP | PIC® 32MZ | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | MIPS32® M-Class | 200MHz | 2.1 V ~ 3.6 V | 78 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
2,664
In-stock
|
Microchip Technology | IC MCU 32BIT 512KB FLASH 100TQFP | PIC® 32MZ | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | MIPS32® M-Class | 200MHz | 2.1 V ~ 3.6 V | 78 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
2,697
In-stock
|
Microchip Technology | IC MCU 32BIT 512KB FLASH 100TQFP | PIC® 32MZ | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (12x12) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | MIPS32® M-Class | 200MHz | 2.1 V ~ 3.6 V | 78 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
1,128
In-stock
|
STMicroelectronics | IC MCU 32BIT 2MB FLASH 324BGA | SPC56 | Active | Tray | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 190 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
3,983
In-stock
|
STMicroelectronics | IC MCU 32BIT 2MB FLASH 324BGA | SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 190 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
3,723
In-stock
|
Microchip Technology | IC MCU 32BIT 512KB FLASH 100TQFP | PIC® 32MZ | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | MIPS32® M-Class | 200MHz | 2.1 V ~ 3.6 V | 78 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
686
In-stock
|
Microchip Technology | IC MCU 32BIT 512KB FLASH 100TQFP | PIC® 32MZ | Active | Tray | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (12x12) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | MIPS32® M-Class | 200MHz | 2.1 V ~ 3.6 V | 78 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
1,673
In-stock
|
Microchip Technology | IC MCU 32BIT 512KB FLASH 100TQFP | PIC® 32MZ | Active | Tray | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | MIPS32® M-Class | 200MHz | 2.1 V ~ 3.6 V | 78 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
2,421
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
1,118
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
1,975
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
2,711
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | ||||
