- Part Status :
- Operating Temperature :
- Supplier Device Package :
-
- 176-LQFP (24x20) (1)
- 176-LQFP (24x24) (34)
- 176-LQFP (26x26) (2)
- 208-LQFP (28x28) (4)
- 208-MAPBGA (17x17) (5)
- 252-MAPBGA (17x17) (2)
- 256-MAPPBGA (17x17) (15)
- 324-MAPBGA (19x19) (3)
- 324-PBGA (23x23) (7)
- 324-TEPBGA (23x23) (7)
- 416-PBGA (27x27) (6)
- 516-FPBGA (27x27) (6)
- 516-MAPBGA (27x27) (4)
- 516-PBGA (27x27) (2)
- PG-BGA-416-10 (2)
- Core Size :
- Connectivity :
-
- ASC, CAN, EBI/EMI, MLI, MSC, SSC (2)
- CAN, CSIO, I²C, LIN, UART/USART (4)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SPI (8)
- CAN, EBI/EMI, LIN, SCI, SPI (31)
- CAN, EBI/EMI, LIN, SCI, SPI, UART/USART (1)
- CAN, EBI/EMI, SCI, SPI (8)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (40)
- CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART (3)
- CAN, SCI, SPI (6)
- Oscillator Type :
- Applied Filters :
103 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
1,040
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
3,208
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
673
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
3,618
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
3,873
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
1,497
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 516BGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
3,195
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
3,498
In-stock
|
NXP USA Inc. | 4M FLASH 256K RAM Z7 264MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
1,949
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
1,119
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
1,068
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,639
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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1,774
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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|
817
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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3,703
In-stock
|
NXP USA Inc. | 32 BITDUAL CORE4M FLAS | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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1,003
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU TRIPLE CORE 4MB | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,208
In-stock
|
NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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1,587
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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1,276
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
2,178
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,866
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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1,043
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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2,665
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,334
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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|
621
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,359
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
896
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/120MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
2,173
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,731
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/120MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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|
RFQ |
2,686
In-stock
|
Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC11xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | PG-BGA-416-10 | DMA, POR, WDT | TriCore™ | 180MHz | 1.42 V ~ 1.58 V | 219 | 224K x 8 | 32-Bit | ASC, CAN, EBI/EMI, MLI, MSC, SSC | 4MB (4M x 8) | Flash | - | A/D 48x12b | Internal | |||
