- Series :
- Packaging :
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27 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
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3,950
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
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3,408
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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1,582
In-stock
|
NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,139
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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865
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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3,620
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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916
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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3,418
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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3,588
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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1,365
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,163
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,784
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,551
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,975
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,606
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 125°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,470
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,549
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,943
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,698
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,568
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,886
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,703
In-stock
|
NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,978
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,037
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,281
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 125°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,595
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384 RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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936
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384 RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
