- Part Status :
- Operating Temperature :
- Voltage - Supply (Vcc/Vdd) :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI (10)
- CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB (2)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SPI (10)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI, ZipWire (7)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (30)
- CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART (3)
- CAN, FlexIO, I²C, LIN, SPI, UART/USART (1)
- EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI (6)
- Program Memory Size :
- Program Memory Type :
- Applied Filters :
71 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
RFQ |
2,175
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
RFQ |
3,096
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
2,209
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
859
In-stock
|
NXP USA Inc. | IC MCU 32BIT 6MB FLASH 324MAPBGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
705
In-stock
|
NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
1,724
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
2,808
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
3,518
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
3,246
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
1,731
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
3,203
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
1,500
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
682
In-stock
|
NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
1,506
In-stock
|
NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,807
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
1,572
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
3,739
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
2,601
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
3,085
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
|
|
642
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
3,152
In-stock
|
NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,689
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
2,825
In-stock
|
NXP USA Inc. | NXP 32 BIT MCU 2M FLASH 1.5MB | S32R | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | POR, PWM, WDT | e200z4, e200z7 (2) | 180MHz, 240MHz | 1.19 V ~ 5.5 V | - | 1.5M x 8 | 32-Bit Tri-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI, ZipWire | 2MB (2M x 8) | Flash | 64K x 8 | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | ||||
|
|
645
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,537
In-stock
|
NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
2,646
In-stock
|
NXP USA Inc. | IC MCU 32BIT 6MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
1,114
In-stock
|
NXP USA Inc. | 32 BIT6MB FLASH768 RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
790
In-stock
|
NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,448
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
1,182
In-stock
|
NXP USA Inc. | NXP 32 BIT MCU 2M FLASH 1.5MB | S32R | Active | Tray | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | POR, PWM, WDT | e200z4, e200z7 (2) | 180MHz, 240MHz | 1.19 V ~ 5.5 V | - | 1.5M x 8 | 32-Bit Tri-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI, ZipWire | 2MB (2M x 8) | Flash | 64K x 8 | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | ||||
