Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
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RFQ
1,003
In-stock
NXP USA Inc. NXP 32-BIT MCU TRIPLE CORE 4MB MPC57xx Active Tray -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
2,208
In-stock
NXP USA Inc. ULTRA RELIABLE MCU WITH VAST PER MPC57xx Active Tray -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
3,866
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
1,043
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
SPC5747GSK1MKU6
RFQ
3,476
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 176LQFP MPC57xx Active Tray -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GBK1VMJ6
RFQ
815
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 256MAPBGA MPC57xx Active Tray -40°C ~ 105°C (TA) 256-LBGA 256-MAPPBGA (17x17) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 178 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
900
In-stock
NXP USA Inc. NXP 32-BIT MCU TRIPLE CORE 4MB MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
3,088
In-stock
NXP USA Inc. ULTRA RELIABLE MCU WITH VAST PER MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
2,320
In-stock
NXP USA Inc. ULTRA RELIABLE MCU WITH VAST PER MPC57xx Active Tray -40°C ~ 125°C (TA) 256-LBGA 256-MAPPBGA (17x17) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/120MHz 3 V ~ 5.5 V 178 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GK1MMJ6
RFQ
1,609
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 256MAPBGA MPC57xx Active Tray -40°C ~ 125°C (TA) 256-LBGA 256-MAPPBGA (17x17) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 178 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GK1MKU6
RFQ
1,220
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 176LQFP MPC57xx Active Tray -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GSK1MKU6R
RFQ
3,324
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 176LQFP MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
620
In-stock
NXP USA Inc. ULTRA RELIABLE MCU WITH VAST PER MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 256-LBGA 256-MAPPBGA (17x17) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 178 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GK1MMJ6R
RFQ
3,227
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 256MAPBGA MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 256-LBGA 256-MAPPBGA (17x17) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 178 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GK1CKU6
RFQ
3,316
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 176LQFP MPC57xx Active Tray -40°C ~ 85°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GK1MKU6R
RFQ
2,676
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 176LQFP MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/160MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
SPC5747GK1CKU2
RFQ
3,151
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 176LQFP MPC57xx Active Tray -40°C ~ 85°C (TA) 176-LQFP Exposed Pad 176-LQFP (24x24) DMA, LVD, POR, WDT e200z2, e200z4, e200z4 80MHz/120MHz 3 V ~ 5.5 V 129 768K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG 4MB (4M x 8) Flash A/D 80x10b, 64x12b Internal
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RFQ
2,476
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
SAC57D54HCVMO
RFQ
3,808
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 516MAPBGA MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
2,283
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
3,439
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
1,054
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
SAC57D54HCVLT
RFQ
603
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 208LQFP MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
2,623
In-stock
NXP USA Inc. FREESCALE 32-BIT MCU TRIPLE POW Automotive, AEC-Q100 MPC57xx Active Tray -40°C ~ 125°C (TA) 176-LQFP 176-LQFP (24x24) DMA, LVD, POR, Zipwire e200z4 150MHz 3.5 V ~ 5.5 V - 256K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART 4MB (4M x 8) Flash A/D 12b SAR, 16b Sigma-Delta Internal
SPC5746RK1MMT5R
RFQ
1,213
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 252MAPBGA Automotive, AEC-Q100 MPC57xx Active Tape & Reel (TR) -40°C ~ 125°C (TA) 252-LFBGA 252-MAPBGA (17x17) DMA, LVD, POR, Zipwire e200z4 200MHz 3.5 V ~ 5.5 V - 256K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART 4MB (4M x 8) Flash A/D 12b SAR, 16b Sigma-Delta Internal
SPC5746RK1MMT5
RFQ
1,299
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 252MAPBGA Automotive, AEC-Q100 MPC57xx Active Tray -40°C ~ 125°C (TA) 252-LFBGA 252-MAPBGA (17x17) DMA, LVD, POR, Zipwire e200z4 200MHz 3.5 V ~ 5.5 V - 256K x 8 32-Bit Tri-Core CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART 4MB (4M x 8) Flash A/D 12b SAR, 16b Sigma-Delta Internal