- Part Status :
- Packaging :
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19 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
RFQ |
2,136
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | |||
|
|
RFQ |
1,176
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | |||
|
RFQ |
816
In-stock
|
Cypress Semiconductor Corp | IC MCU 32BIT ROMLESS 100QFP | FR30 MB91101 | Obsolete | - | -40°C ~ 70°C (TA) | - | - | DMA, POR, PWM, WDT | FR30 RISC | 50MHz | 2.7 V ~ 5.5 V | - | 2K x 8 | 32-Bit | UART/USART | ROMless | A/D 4x10b | External | |||
|
|
RFQ |
3,703
In-stock
|
Cypress Semiconductor Corp | IC MCU 32BIT ROMLESS 100LQFP | FR30 MB91101 | Obsolete | Tray | -40°C ~ 70°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA, POR, PWM, WDT | FR30 RISC | 50MHz | 2.7 V ~ 5.5 V | - | 2K x 8 | 32-Bit | UART/USART | ROMless | A/D 4x10b | External | |||
|
|
619
In-stock
|
NXP USA Inc. | AMADEUS+USB | MCF525x | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||||
|
|
1,119
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Active | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||||
|
|
1,903
In-stock
|
Cypress Semiconductor Corp | IC MCU 32BIT ROMLESS 100QFP | FR30 MB91101 | Active | - | -40°C ~ 70°C (TA) | - | - | DMA, POR, PWM, WDT | FR30 RISC | 50MHz | 2.7 V ~ 5.5 V | - | 2K x 8 | 32-Bit | UART/USART | ROMless | A/D 4x10b | External | ||||
|
|
3,833
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||||
|
|
1,376
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||||
|
|
3,435
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||||
|
RFQ |
3,749
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 364BGA | Vybrid, VF6xx | Obsolete | Tray | -40°C ~ 85°C | 364-LFBGA | 364-LFBGA (17x17) | DMA, LVD, WDT | ARM® Cortex®-A5 + Cortex®-M4 | 400MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | ROMless | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
|
RFQ |
828
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 364BGA | Vybrid, VF6xx | Obsolete | Tray | -40°C ~ 85°C | 364-LFBGA | 364-LFBGA (17x17) | DMA, LVD, WDT | ARM® Cortex®-A5 + Cortex®-M4 | 500MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | ROMless | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
|
RFQ |
2,198
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 364BGA | Vybrid, VF6xx | Obsolete | Tray | -40°C ~ 85°C | 364-LFBGA | 364-LFBGA (17x17) | DMA, LVD, WDT | ARM® Cortex®-A5 + Cortex®-M4 | 500MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | ROMless | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
RFQ |
920
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 176LQFP | Vybrid, VF3xx | Obsolete | Tray | -40°C ~ 85°C | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | DMA, LVD, WDT | ARM® Cortex®-A5 | 266MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Single-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | ROMless | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
|
RFQ |
1,734
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 176LQFP | Vybrid, VF3xx | Obsolete | Tray | -40°C ~ 85°C | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | DMA, LVD, WDT | ARM® Cortex®-A5 | 266MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Single-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | ROMless | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
1,488
In-stock
|
Analog Devices Inc. | IC MCU 16BIT ROMLESS 68PLCC | - | Active | Tube | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | - | DMA | - | 25MHz | 4.5 V ~ 5.5 V | - | - | 16-Bit | EBI/EMI, UART/USART | ROMless | - | Internal | ||||
|
|
1,625
In-stock
|
Analog Devices Inc. | IC MCU 16BIT ROMLESS 68PLCC | - | Active | Tube | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | - | DMA | - | 25MHz | 4.5 V ~ 5.5 V | - | - | 16-Bit | EBI/EMI, UART/USART | ROMless | - | Internal | ||||
|
2,549
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC3100 | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 180MHz | 1.1 V ~ 3.6 V | - | 96K x 8 | 16/32-Bit | EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG | ROMless | A/D 4x10b | External | ||||
|
|
3,489
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC3100 | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 180MHz | 1.1 V ~ 3.6 V | - | 192K x 8 | 16/32-Bit | EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG | ROMless | A/D 4x10b | External | ||||
