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36 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Type | Frequency - Max | Supplier Device Package | Number of Circuits | Voltage - Supply | Output | Input | Ratio - Input:Output | Differential - Input:Output | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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3,048
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.635 V | LVDS | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
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RFQ |
1,928
In-stock
|
Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:1 | Yes/Yes | |||
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2,862
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
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3,338
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
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RFQ |
871
In-stock
|
Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, LVDS, LVPECL | 1:1 | Yes/Yes | |||
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2,087
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
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2,803
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
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RFQ |
2,901
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 1:1 | Yes/Yes | |||
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2,299
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
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2,677
In-stock
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Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
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RFQ |
1,305
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Fanout Buffer (Distribution) | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 2.635 V | LVDS | LVDS | 1:2 | Yes/Yes | |||
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1,958
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Fanout Buffer (Distribution) | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 2.635 V | LVDS | LVDS | 1:2 | Yes/Yes | ||||
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1,728
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Fanout Buffer (Distribution) | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 2.635 V | LVDS | LVDS | 1:2 | Yes/Yes | ||||
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RFQ |
3,729
In-stock
|
Microchip Technology | IC CLK BUFFER 2:12 3GHZ 44MLF | Precision Edge® | Obsolete | Tube | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF® | Fanout Buffer (Distribution), Multiplexer | 3GHz | 44-MLF® (7x7) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 2:12 | Yes/Yes | |||
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RFQ |
3,421
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:2 | Yes/Yes | |||
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3,291
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
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2,092
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
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RFQ |
3,192
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MLF | Precision Edge® | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Fanout Buffer (Distribution) | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | |||
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2,537
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MLF | Precision Edge® | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Fanout Buffer (Distribution) | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | ||||
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2,361
In-stock
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Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Fanout Buffer (Distribution) | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | ||||
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RFQ |
1,405
In-stock
|
Microchip Technology | IC CLK BUFFER 2:12 3GHZ 44MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF® | Fanout Buffer (Distribution), Multiplexer | 3GHz | 44-MLF® (7x7) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 2:12 | Yes/Yes | |||
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2,903
In-stock
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Microchip Technology | IC CLK BUFFER 2:12 3GHZ 44MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF® | Fanout Buffer (Distribution), Multiplexer | 3GHz | 44-MLF® (7x7) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 2:12 | Yes/Yes | ||||
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1,475
In-stock
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Microchip Technology | IC CLK BUFFER 2:12 3GHZ 44MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF® | Fanout Buffer (Distribution), Multiplexer | 3GHz | 44-MLF® (7x7) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 2:12 | Yes/Yes | ||||
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764
In-stock
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Microchip Technology | IC CLK BUFFER 2:12 3GHZ 44MLF | Precision Edge® | Active | Tray | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF® | Fanout Buffer (Distribution), Multiplexer | 3GHz | 44-MLF® (7x7) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 2:12 | Yes/Yes | ||||
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1,553
In-stock
|
Microchip Technology | IC CLK BUFFER 2:6 3GHZ 32MLF | Precision Edge® | Active | Tube | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF® | Fanout Buffer (Distribution), Multiplexer | 3GHz | 32-MLF® (5x5) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, PECL | 2:6 | Yes/Yes | ||||
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1,727
In-stock
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Microchip Technology | IC CLK BUFFER 1:8 3GHZ 32MLF | Precision Edge® | Active | Tube | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF® | Fanout Buffer (Distribution) | 3GHz | 32-MLF® (5x5) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, PECL | 1:8 | Yes/Yes | ||||
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1,310
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Tray | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.6 V | LVPECL | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
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3,479
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Tray | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
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RFQ |
1,839
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.635 V | LVDS | CML, LVDS, LVPECL | 1:2 | Yes/Yes | |||
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3,413
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.635 V | LVDS | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
