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23301 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze
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Aries Electronics CONN IC DIP SOCKET 30POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze
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Mill-Max Manufacturing Corp. CONN IC SKT DBL $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Mill-Max Manufacturing Corp. CONN IC SKT DBL $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD $proddata[$product['id']]['package'] -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD $proddata[$product['id']]['package'] -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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Aries Electronics CONN SOCKET SIP 2POS GOLD $proddata[$product['id']]['package'] - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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Aries Electronics CONN SOCKET SIP 30POS TIN $proddata[$product['id']]['package'] -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (1 x 30) Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze
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Aries Electronics CONN SOCKET SIP 30POS TIN $proddata[$product['id']]['package'] -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (1 x 30) Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze
28-6823-90
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD $proddata[$product['id']]['package'] - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze
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Mill-Max Manufacturing Corp. STANDRD SOLDRTL DBL SKT $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder - Zig-Zag, Right Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) - - - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) - Brass Alloy
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Samtec Inc. .100" SCREW MACHINE SOCKET ARRAY $proddata[$product['id']]['package'] -55°C ~ 140°C Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) - 0.100" (2.54mm) 10.0µin (0.25µm) -
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Mill-Max Manufacturing Corp. SKT IC OPEN LOWPRO $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Mill-Max Manufacturing Corp. CONN IC SKT DBL $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Mill-Max Manufacturing Corp. CONN IC SKT DBL $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Mill-Max Manufacturing Corp. CONN IC SKT DBL $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Mill-Max Manufacturing Corp. CONN IC SKT DBL $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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Aries Electronics CONN SOCKET SIP 21POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper - 10.0µin (0.25µm) Brass
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Aries Electronics CONN SOCKET SIP 21POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper - 10.0µin (0.25µm) Brass
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Preci-Dip CONN SOCKET PGA 101POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 101 (13 x 13) Beryllium Copper 0.100" (2.54mm) - Brass
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Samtec Inc. .100" SCREW MACHINE SOCKET ARRAY $proddata[$product['id']]['package'] -55°C ~ 140°C Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Tin - - 54 (3 x 18) - 0.100" (2.54mm) - -
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Samtec Inc. .100" LOW PROFILE SCREW MACHINE $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Brass
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Samtec Inc. .100" SCREW MACHINE DIP SOCKET $proddata[$product['id']]['package'] -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Brass
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Samtec Inc. ADAPTER PLUG $proddata[$product['id']]['package'] - Through Hole Solder Open Frame - Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) 20.0µin (0.51µm) Phosphor Bronze
110-93-318-41-105000
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD $proddata[$product['id']]['package'] -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy